ChipMOS TECHNOLOGIES (Bermuda) LTD. ("ChipMOS"), listed on the Nasdaq Capital Market (NASDAQ: IMOS), is a leading independent provider of total semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM) and foundries.
We provide a broad range of back-end testing services for high density memory, mixed-signal and liquid crystal display (LCD) driver semiconductors. In addition, we offer a comprehensive selection of leadframe-based and organic substrate-based package assembly services for memory, mixed-signal, and LCD driver semiconductors which are used in diverse end-use markets, including personal computers, communications equipment, office automation and consumer electronics. Our testing and packaging services are provided both separately and on a turnkey basis.
With operations headquartered in Taiwan, most of testing is currently conducted at our facility in the Hsinchu Science Park while the packaging is mostly conducted at our Southern Taiwan Science Park facility. We started our mainland China operation in 2003 located in Qingpu Shanghai. With the successful merger of AMCT in 2003, we also provide gold bumping services at Chupei, Hsinchu.
In addition to our unique back-end solutions, we work in collaboration with our global client base to provide a complete range of vertically integrated solutions from design through drop-shipment.
Close collaboration between our R&D teams and customers ensure technology roadmaps with synchronized production readiness of new test and package solutions for increasingly sophisticated semiconductor products. Growing with our customers leverages and expands our deployment of advanced engineering skills and capabilities for ongoing cost reduction such as software conversion programs and parallel testing for client testing operations.