Gold Bumping Services
ChipMOS has the expertises and experiences to provide testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, mixed signal and LCD devices...
ChipMOS offers a broad range of package families designed to provide our customers with an array of packaging solutions...
Gold Bumping technology, which is a predecessor process of TCP, COF and COG packaging, is a necessary interconnection technology for LCD and other flat-panel display driver semiconductors...
ChipMOS is continuously strivng for the R&D of innovative technologies, including Stacked CSP, FCOB, SiP, KGD, CMOS Image Sensor technology, etc...
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