What is Gold Bumping? Gold Bumping technology, which is a predecessor process of TCP, COF and COG packaging, is a necessary interconnection technology for LCD and other flat-panel display driver semiconductors. Gold bump is formed on the designed I/O pad with the height of 12-18 μm. Gold bumps play the role as the interconnections between chips and tapes in TCP and COF packages and the glass substrates in COG package.
Most gold bump processes are done on 6 and 8 inch wafers. Gold bumping process provides the best solution for fine pitch chips and is able to meet the high production requirement for LCD driver ICs, or other application chips that need low packaging profiles.
Gold Bumping at ChipMOS To provide customers with complete service, ChipMOS acquired Advanced Micro Chip Technology (AMCT) in April 2004 and since then ChipMOS has successfully extended its supply chain of LCD driver from packaging to wafer bumping. Currently ChipMOS contributes more than 40% of the total volume of the LCD drivers packaged in Taiwan.
Turnkey service from ChipMOS ensures customers the most secured production capacity and the highest level of logistic support. The integration of engineering team from bumping to packaging makes customers' products reaching the yield peak that can't be done at any other bumping site in the world. From the aspects of volume, quality, and yield, ChipMOS is definitely your first and the best choice.