There is a continuing trend to compactness and lighter weight in the development of electronic products, especially for flat panel displays with high-resolution requirement. As an advanced LCD driver semiconductor packaging technology, COF has many advantages against the conventional tape carrier package (TCP), including structure and application.
What is COF The major differences of COF package, as compared to TCP, are the bonding technology involved and the design of the tape material which is developed with 2-layer structure without device hole. Please refer to the following figures for the details.
Not only limited to the eutectic process as TCP technology, the NCP and ACF bonding process has been developed by ChipMOS for various customers' requirements since 2001. COF module manufacturing technology is also available.
Benefits of COF ‧Miniaturized, low profile & light-weight ‧Fine patterning pitch ‧Adhesive-free 2-layers tape structure, flexible, high bending strength and no flex slit ‧High reliability ‧Modularized (COF module) capability